Diffusion bonding is a solid-state joining process that uses atomic diffusion to create a metallurgical bond between two materials. The materials are brought into contact under high pressures and elevated temperatures, causing atoms to migrate between them and interlock without melting the base materials.
The process creates high strength bonds comparable to the parent material and can join aluminium to other metals, ceramics and composites with low distortion and minimal residual stress. Used in aerospace, automotive and electronics to create high-performing, reliable joints, diffusion bonding doesn’t require filler materials and can create complex geometries.
TWI has developed a technique for diffusion bonding aluminium that achieves joint strengths comparable to the heat-treated parent material, without the need for interlayers or melting point suppressants.
You can see a short video about diffusion bonding, created by TWI, here:
